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Lista de obras de Göran Stemme

A Low-Temperature Thermopneumatic Actuation Principle for Gas Bubble Microvalves

A compact passive air flow regulator for portable breath diagnostics

A compact, low-cost microliter-range liquid dispenser based on expandable microspheres

A comparative study of the bonding energy in adhesive wafer bonding

A concept for miniaturized 3-D cell culture using an extracellular matrix gel.

artículo científico publicado en 2005

A disposable lab-on-a-chip platform with embedded fluid actuators for active nanoliter liquid handling

artículo científico publicado en 2007

A fast passive and planar liquid sample micromixer

artículo científico publicado en 2004

A high-stroke, high-pressure electrostatic actuator for valve applications

article

A low-power high-flow shape memory alloy wire gas microvalve

A microfluidic device for parallel 3-D cell cultures in asymmetric environments

artículo científico publicado en 2007

A micromachined interface for airborne sample-to-liquid transfer and its application in a biosensor system.

artículo científico publicado en 2006

A micromachined interface for transfer of liquid or vapour sample to a liquid solution

A new silicon gas-flow sensor based on lift force

A packaged optical slot-waveguide ring resonator sensor array for multiplex label-free assays in labs-on-chips.

artículo científico publicado en 2009

A ppb level, miniaturized fast response amperometric nitric oxide sensor for asthma diagnostics

article published in 2013

A seat microvalve nozzle for optimal gas-flow capacity at large-controlled pressure

A silicon resonant sensor structure for Coriolis mass-flow measurements

A static turbine flow meter with a micromachined silicon torque sensor

A valve-less diffuser micropump for microfluidic analytical systems

article by Helene Andersson et al published February 2001 in Sensors and Actuators B

Active Opening Force and Passive Contact Force Electrostatic Switches for Soft Metal Contact Materials

Adhesive copper films for an air-breathing polymer electrolyte fuel cell

Adhesive wafer bonding with ultra-thin intermediate polymer layers

An Autonomous Microfluidic Device for Generating Volume-Defined Dried Plasma Spots

scientific article published on 15 May 2019

An integrated QCM-based narcotics sensing microsystem.

artículo científico publicado en 2008

An optical IR-source and CO/sub 2/-chamber system for CO/sub 2/ measurements

Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding

Awafer-level, heterogeneously integrated, high flow SMA-silicon gas microvalve

BCB contact printing for patterned adhesive full-wafer bonded 0-level packages

Behaviour and design considerations for continuous flow closed-open-closed liquid microchannels

artículo científico publicado en 2005

CMOS-Integrable Piston-Type Micro-Mirror Array for Adaptive Optics Made of Mono-Crystalline Silicon using 3-D Integration

Characteristics of a hot-wire microsensor for time-dependent wall shear stress measurements

Characterization of micromachined hollow tips for two-dimensional nanoelectrospray mass spectrometry.

artículo científico publicado en 2003

Characterization of micromachined spiked biopotential electrodes

artículo científico publicado en 2002

Consecutive microcontact printing — ligands for asymmetric catalysis in silicon channels

Coplanar-waveguide embedded mechanically-bistable DC-to-RF MEMS switches

Design and Fabrication Aspects of an S-Shaped Film Actuator Based DC to RF MEMS Switch

Electrohydrodynamic enhanced transport and trapping of airborne particles to a microfluidic air-liquid interface

Evaluation of a Volumetric Dried Blood Spot Card Using a Gravimetric Method and a Bioanalytical Method with Capillary Blood from 44 Volunteers

artículo científico publicado en 2019

Expandable microspheres for the handling of liquids

artículo científico publicado en 2002

Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires

scholarly article published January 2011

Fast narcotics and explosives detection using a microfluidic sample interface

Full wafer integration of shape memory alloy microactuators using adhesive bonding

Genotyping by dynamic heating of monolayered beads on a microheated surface.

artículo científico publicado en 2004

Hermetic integration of liquids in MEMS by room temperature, high-speed plugging of liquid-filled cavities at wafer level

Heterogeneous 3D integration of 17 μm pitch Si/SiGe quantum well bolometer arrays for infrared imaging systems

Heterogeneous integration for optical MEMS

Heterogeneous integration technology for combination of different wafer sizes using an expandable handle substrate

scholarly article published January 2011

Hidden-hinge micro-mirror arrays made by heterogeneous integration of two mono-crystalline silicon layers

High aspect ratio TSVs fabricated by magnetic self-assembly of gold-coated nickel wires

scholarly article published May 2012

High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires

scholarly article by Simon J. Bleiker et al published January 2015 in IEEE transactions on components, packaging, and manufacturing technology

High-performance infrared micro-bolometer arrays manufactured using very large scale heterogeneous integration

High-performance quantum-well silicon-germanium bolometers using IC-compatible integration for low-cost infrared imagers

scholarly article published June 2009

Hybrid-mounted micromachined aluminum hotwires for wall shear-stress measurements

scholarly article by S. Haasl et al published April 2005 in IEEE Journal of Microelectromechanical Systems

Immobilized oxazoline-containing ligands in asymmetric catalysis--a review.

artículo científico publicado en 2002

Layer-by-layer 3D printing of Si micro- and nanostructures by Si deposition, ion implantation and selective Si etching

Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration

Low temperature full wafer adhesive bonding of structured wafers

Low-cost through silicon vias (TSVs) with wire-bonded metal cores and low capacitive substrate-coupling

Low-temperature CMOS-compatible 3D-integration of monocrystalline-silicon based PZT RF MEMS switch actuators on rf substrates

Low-temperature wafer-level transfer bonding

MEMS single-chip microswitch array for re-configuration of telecommunication networks

scholarly article published September 2006

Maskless selective electrochemically assisted wet etching of metal layers for 3D micromachined SOI RF MEMS devices

Mechanically Bi-Stable In-Plane Switch with Dual-Stiffness Actuators

Mechanically tri-stable SPDT metal-contact MEMS switch embedded in 3D transmission line

Mechanically tri-stable, true single-pole-double-throw (SPDT) switches

article by J Oberhammer et al published 12 September 2006 in Journal of Micromechanics and Microengineering

Membrane-sealed hollow microneedles and related administration schemes for transdermal drug delivery

artículo científico publicado en 2008

Microactuation Utilizing Wafer-Level Integrated SMA Wires

Microfluidic and transducer technologies for lab on a chip applications

artículo científico publicado en 2010

Microfluidic devices for studies of primary cilium mediated cellular response to dynamic flow conditions

artículo científico publicado en 2008

Micromachined electrodes for biopotential measurements

Micromachined filter-chamber array with passive valves for biochemical assays on beads

artículo científico publicado en 2001

Micromachined flat-walled valveless diffuser pumps

article published in 1997

Multi-position large tuning-range digitally tuneable capacitors embedded in 3D micromachined transmission lines

article

Novel microneedle patches for active insulin delivery are efficient in maintaining glycaemic control: an initial comparison with subcutaneous administration

artículo científico publicado en 2007

Off-line integration of CE and MALDI-MS using a closed-open-closed microchannel system

artículo científico publicado en 2007

On-chip temperature compensation in an integrated slot-waveguide ring resonator refractive index sensor array

artículo científico publicado en 2010

Out-of-Plane Knife-Gate Microvalves for Controlling Large Gas Flows

Painless drug delivery through microneedle-based transdermal patches featuring active infusion

artículo científico publicado en 2008

Patterned self-assembled beads in silicon channels

artículo científico publicado en 2001

Pt-Al2O3 dual layer atomic layer deposition coating in high aspect ratio nanopores

artículo científico publicado en 2013

Pyrosequencing in a microfluidic flow-through device

artículo científico publicado en 2005

RF MEMS High-Impedance Tuneable Metamaterials for Millimeter-Wave Beam Steering

Rapid melting curve analysis on monolayered beads for high-throughput genotyping of single-nucleotide polymorphisms

artículo científico publicado en 2006

Robust actuation of silicon MEMS using SMA wires integrated at wafer-level by nickel electroplating

scholarly article by Donato Clausi et al published January 2013 in Sensors and Actuators A

Room-Temperature Sealing of Microcavities by Cold Metal Welding

Room-temperature wafer-level hermetic sealing for liquid reservoirs by gold ring embossing

Room-temperature wafer-level vacuum sealing by compression of high-speed wire bonded gold bumps

Row/Column Addressing Scheme for Large Electrostatic Actuator MEMS Switch Arrays and Optimization of the Operational Reliability by Statistical Analysis

article published in 2008

Scalable Manufacturing of Single Nanowire Devices Using Crack-Defined Shadow Mask Lithography

artículo científico publicado en 2019

Sealing of adhesive bonded devices on wafer level

Selective electrochemical release etching of eutectically bonded microstructures

Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures

scholarly article published January 2010

Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities

Self-assembled and self-sorted array of chemically active beads for analytical and biochemical screening

scientific article published on 01 February 2002

Silicon based flow sensors used for mean velocity and turbulence measurements

Single nucleotide polymorphism analysis by allele-specific primer extension with real-time bioluminescence detection in a microfluidic device

artículo científico publicado en 2003

Single-chip MEMS 5 × 5 and 20 × 20 double-pole single-throw switch arrays for automating telecommunication networks

scholarly article by S Braun et al published 3 December 2007 in Journal of Micromechanics and Microengineering

Small silicon based pressure transducers for measurements in turbulent boundary layers

Smart Individual Switch Addressing of 5 � 5 and 20 � 20 MEMS Double-Switch Arrays

Tapered Deep Reactive Ion Etching: Method and Characterization

Temporary wafer bonding and debonding by an electrochemically active polymer adhesive for 3D integration

Thin film crystal growth template removal: Application to stress reduction in lead zirconate titanate microstructures

Unconventional applications of wire bonding create opportunities for microsystem integration

Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires

scholarly article by A C Fischer et al published 17 August 2012 in Journal of Micromechanics and Microengineering

Very large scale heterogeneous system integration for 1-megapixel mono-crystalline silicon micro-mirror array on CMOS driving electronics

Vibration modes of a resonant silicon tube density sensor

article

Void-free pull wafer adhesive bonding

Wafer counter-bonding for integrating cte-mismatched substrates and its application to MEMS tuneable metamaterials

Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS

artículo científico publicado en 2011

Wafer-Level Process for Single-Use Buckling-Film Microliter-Range Pumps

article published in 2007

Wafer-Level Vacuum Packaging Enabled by Plastic Deformation and Low-Temperature Welding of Copper Sealing Rings With a Small Footprint

article published in 2017

Wafer-level heterogeneous 3D integration for MEMS and NEMS

Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology

Wire-bonded through-silicon vias with low capacitive substrate coupling

Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates